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Global Automakers’ SDV Strategies and Competition for Semiconductors

There is a growing interest in the strategies and trends of policies and regulations in the world’s major countries, automakers, component suppliers, and related stakeholders with regard to competition in the global SDV era.
It is important to investigate the status of initiatives in software-related as well as hardware, and to analyze the competition for survival among industries that is expected as the SDV shift continues.

The acquisition of semiconductors for the realization of SDV strategies by major automakers is backed by national economic security and competition to capture semiconductors from major countries. Based on the current state of semiconductor technology and technological trends and changes in E/E architecture and control technology, trends in the development and mass production progress of high-performance semiconductors and the cooperation between automakers and semiconductor In light of the current state of semiconductor technology, technological trends, and changes in E/E architecture and control technology, it has become necessary to monitor in real time the progress of development and mass production of high-performance semiconductors and the status of cooperation between automakers and semiconductor manufacturers. As a reference material for confirming the trends of automakers and related suppliers and for forecasting and judging the future in the SDV field, we will discuss the latest trends in the age of AI-defined vehicles and the preparations that Japan should take, the current status of SDV development and efforts for the future, the introduction of the Tesla FSD (Supervised) to the Japanese market, and the future of the SDV era and the SDV market. It is important to keep an eye on the SDV era and European standardization trends while keeping an eye on the introduction of Tesla FSD (Supervised) to the Japanese market, and to look at the future of global collaboration for the promotion of SDV development.

In addition, in-vehicle wired telecommunications are becoming faster and more networked in anticipation of advanced sensors and ADAS, SDV, and autonomous driving. While in-vehicle Ethernet is the most promising high-speed backbone technology, large amounts of raw image and video data from cameras for a wide range of purposes, including human visual inspection and automatic braking, are also being transferred. This is said to be transmitted outside of the backbone network for the time being.

Although many methods have been proposed and developed for asymmetric LVDS high-speed digital communication (i.e., bi-directional communication with greatly different transmission speeds depending on the direction), both open standards and proprietary standards share some common technical elements regarding the transmission technology. This lecture will provide an understanding of the fundamentals of LVDS asymmetric high-speed digital communications, not as a specific standard, but rather as a broad overview of what aspects of high-speed digital transmission should be considered, and what analysis methods are useful. What should be considered for high-speed digital transmission and what kind of analysis methods are useful should also be considered.

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